Flip Chip Market By Packaging Process 2021 | IndustryARC
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Flip Chip Market
Flip Chip Market: By Packaging Process (fcBGA, fcCsp, WLP, Others), By end users (Smartphones, Laptops, Automotive, Robotics, Medical Devices, Others), By applications (2D logic system-on-a-chip, Memory, Imaging, Various ICs, Others) – Forecast (2016 - 2021)
Report Code : ESR 0201
Published: 18 January, 2016   No. of pages: 150

  • Report Description
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Flip Chip technology is the method for interconnecting semiconductor devices such as Integrated Circuit chips and Micro-electromechanical systems (MEMS) to external circuitry with solder bumps that have been deposited on the chip pads. The chip is then mounted on the external circuitry with its top side down and properly aligned such that its pads align with the matching pads on the external circuit. Flip Chip offers reduced size of the devices (as packaging density increases) and increased performance. It is cheaper than wire bonding as all the bonds form simultaneously.

The Report ‘Flip Chip Market is segmented into six verticals, namely: By Joining Process, By Bumping Process, By Packaging, By Application, By End users and By Geography. The report is segmented by joining process into Solder joining, Thermo Compression, Thermo Sonic, Adhesive and few others. The report has been divided in terms of Bumping Processes like Copper Pillar, Lead-Free Solder, Tin-Lead eutectic solder, Gold stud and plated Solder and others. On the basis of Type of Packaging, The report is segmented into Flip Chip Ball Grid Array (fcBGA), Flip Chip Chip Scale Package (fcCSP), Wafer Level Packaging and others. The report also discusses the applications like 2D Logic System-on-a-chip, Light Emitting Diode, Imaging, Memory, ICs and many others. The report also distinguishes among the end users such as Telecommunications, Consumer Electronics, Automotive, Industrial, Medical devices and others. The report analyzes the market over the regions like North America, South America, APAC, Europe and Rest of the World.

Flip Chip Market

Flip Chip Market in 2015 was dominated by North America; and closely followed by Europe. The APAC region is the fastest growing market of Flip Chip. Countries in APAC are major manufacturing hubs and are instrumental in increasing the demand. Higher demand of Smartphones and Automobile MCUs globally also enhances the growth of the market.

Key players in Flip Chip are:
  • Taiwan Semiconductor Manufacturing Companies Ltd. (Taiwan)
  • Samsung Group (South Korea)
  • Powertech Technology (Taiwan)
  • STATS ChipPAC Pte. Ltd. (Singapore)
  • Amkor Technology (The U.S.)
  • STMicroelectronics (Switzerland)

The methodology for estimating the Flip Chip Market is depended on the type of Packaging. 3D IC packaging technology has the highest growth rate. Considering the Applications part, Consumer Electronics has the largest market size and also the highest growth rate. Simultaneously, the companies involved in Flip Chip Market are also studied from the perspective of their product portfolio, annual turnover and other parameters. The data was validated with industry experts at technical and market levels.
1. Flip Chip – Market Overview
   1.1. Introduction
   1.2. Market Scope
   1.3. Stakeholders
2. Flip Chip - Executive Summary
3. Flip Chip – Market Landscape

   3.1. Market Share Analysis
      3.1.1. Comprehensive Market Share Analysis
   3.2. Comparative Analysis
      3.2.1. Competitor Benchmarking
      3.2.2. Competitor Financial Analysis
      3.2.3. Patent Analysis
      3.2.4. End-User Profiling
4. Flip Chip – Market Forces
   4.1. Market Drivers
   4.2. Market Constraints
   4.3. Market Challenges
   4.4. Attractiveness of the Smart Parking Solutions Industry
      4.4.1. Power of Suppliers
      4.4.2. Power of Customers
      4.4.3. Threat of New entrants
      4.4.4. Threat of Substitution
      4.4.5. Degree of Competition
5. Flip Chip – Strategic Analysis
   5.1. Value Chain Analysis
   5.2. Pricing Analysis
      5.2.1. Influencing Factor Analysis
      5.2.2. Forecast of Prices
   5.3. Opportunities Analysis
   5.4. Product/Market Life Cycle Analysis
6. Flip Chip – By joining process
   6.1. Introduction
   6.2. Solder Joining
   6.3. Thermo Compression
   6.4. Thermo Sonic Joining
   6.5. Joining by Adhesive
   6.6. Others
7. Flip Chip – By bumping process
   7.1. Introduction
   7.2. Copper (Cu) pillar
   7.3. Lead (Pb) – free solder
   7.4. Tin-Lead (Sn-Pb) eutectic solder
   7.5. Gold stud and Plated solder
   7.6. Others
8. Flip Chip – By Packaging type
   8.1. Flip Chip Ball Grid Array (fcBGA) Technology
   8.2. Flip Chip Chip Scale Package (fcCSP) Technology
   8.3. Wafer Level Packaging
   8.4. Others
9. Flip Chip – By application
   9.1. Introduction
   9.2. 2D logic system-on-a-chip (SoC)
   9.3. Light Emitting Diode
   9.4. Memory
   9.5. Imaging
   9.6. Integrated Circuits
   9.7. Others
10. Flip Chip – By end users
   10.1. Introduction
   10.2. Telecommunications
   10.3. Consumer Electronics
      10.3.1. Smartphones
      10.3.2. Laptops
      10.3.3. Personal Computers
      10.3.4. Gaming Devices
   10.4. Automotive
   10.5. Industrial
      10.5.1. Robotics
      10.5.2. Others
   10.6. Medical devices
   10.7. Others
11. Flip Chip Market - By Geography
   11.1. Introduction
   11.2. North America
      11.2.1. U.S.
      11.2.2. Canada
      11.2.3. Others
   11.3. South America
      11.3.1. Brazil
      11.3.2. Mexico
      11.3.3. Others
   11.4. Europe
      11.4.1. Germany
      11.4.2. U.K.
      11.4.3. France
      11.4.4. Others
   11.5. Asia-Pacific
      11.5.1. China
      11.5.2. Japan
      11.5.3. India
      11.5.4. Others
   11.6. Rest Of the World
      11.6.1. Africa
      11.6.2. Middle-East
12. Market Entropy
   12.1. Introduction
   12.2. Product Launches - Most Dominant Strategy
   12.3. Mergers, Agreements & Partnerships
   12.4. Acquisitions and Others
13.  Company Profiles
   13.1. ASE Group
   13.2. Amkor technology
   13.3. Intel Corporation
   13.4. Powertech Technology
   13.5. STATS ChipPAC Pte. Ltd.
   13.6. Samsung Group
   13.7. Taiwan Semiconductor Manufacturing Company Ltd.
   13.8. United Microelectronics Corporation
   13.9.  Global Foundries
   13.10. STMicroelectronics
   13.11. Flip Chip International, LLC
   13.12. Palomar Technologies
   13.13. Nepes Ltd.
   13.14. Texas Instruments
*More than 40 Companies are profiled in this Research Report, Complete List available on Request*
"*Financials would be provided on a best efforts basis for private companies"
14. Appendix

   14.1. Abbreviations
   14.2. Sources
   14.3. Research Methodology
   14.4. Compilation of Expert Insights
   14.5. Disclaimer
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