Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market By Technology 2021 | IndustryARC
  • 1-614-588-8538 (Ext: 101)
  • US Toll Free

Three-dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnects Market
Three-dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnects Market: By Technology (Silicon on insulator & bulk silicon); By Bonding Technique; By Process Realization; By Fabrication Technology & By Product– With Forecast (2016-2021)
Report Code : ESR 0290
Updated Date: 25 February, 2016  
4

Copies sold

    Client Rating

  • Report Description
  • Table of Contents
  • Customization Options
Modern day electronics depend on the developments and the research, which goes into the manufacturing process of these electronics. The electronic components manufactured also play a pivotal role in the overall size and shape of the final product. In this regard, the development of Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects has allowed device manufacturers to devise consumer electronic devices in a multitude of form factors whilst still ensuring the performance of the system is not affected by the size of the device itself. 3D IC packaging allows for more if not the same level of electronics to be integrated without any compromise on the form factor. In terms of revenue generation, the market is still very much in the early stages and can expect to see a considerable increase in adoption and revenue generation by the end of the forecast period. All the major semiconductor companies have already invested in 3D IC technology as well as in R&D of the same, which indicates the promise, which the technology has in the coming years. Companies operating in this market believe that the return on investment in this market will take place by the end of the forecast period.

In terms of regional contribution, the APAC region will continue to contribute the highest to the region till well beyond the forecast period. The current semiconductor suppliers will be the same organizations that will expand onto 3D IC technology.

Three-dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnects Market

The Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects Market can be segmented as
  • on the basis of technology
    • Silicon on insulator and bulk silicon   
  • In terms of bonding technique
    • Adhesive bonding Die to Die, Die to wafer, Direct bonding, Metallic bonding and Wafer to wafer  
  • In terms of process realization
    • Via first, Via middle and Via last   
  • In terms of fabrication technology
    • Beam Recrystallization, Wafer Bonding, Silicon Epitaxial Growth, Solid Phase Crystallization   
  • In terms of product
    • Memories, light emitting diodes, sensors, power and analog components, micro electro mechanical systems, and others    
  • By Geography
    • North America, South America, APAC, Europe, Middle East and Africa

Following are just a few of the companies that are operating in the Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects Market.

  • Amkor Technology,
  • Elpida Memory Inc.,
  • Intel Corporation ,
  • Micron Technology Inc.,
  • Monolithic 3d Inc.,
  • Renesas Electronics Corporation .
1. Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects– Market Overview
2. Executive Summary
3. Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects– Market Landscape

   3.1. Market Share Analysis
   3.2. Comparative Analysis
      3.2.1. Product Benchmarking
      3.2.2. End User Profiling
      3.2.3. Top 5 Financials Analysis
4. Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects– Market Forces
   4.1. Market Drivers
   4.2. Market Constraints
   4.3. Market Challenges
   4.4. Attractiveness of the Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects Market
      4.4.1. Power of Suppliers
      4.4.2. Power of Customers
      4.4.3. Threat of New Entrants
      4.4.4. Threat of Substitution
      4.4.5. Degree of Competition
5. Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects Market– Strategic Analysis
   5.1. Value Chain Analysis
   5.2. Pricing Analysis
   5.3. Opportunities Analysis
   5.4. Product/Market Life Cycle Analysis
   5.5. Suppliers and Distributors
6. Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects Market– By Technology:
   6.1. Silicon on insulator
   6.2. Bulk silicon
7. Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects Market– By Bonding Technique: 
   7.1. Adhesive bonding Die to Die
   7.2. Die to wafer
   7.3. Direct bonding
   7.4. Metallic bonding
   7.5. Wafer to wafer
8. Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects Market– By Process Realization: 
   8.1. Via first
   8.2. Via middle
   8.3. Via last
9. Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects Market– By Fabrication Technology: 
   9.1. Beam Recrystallization
   9.2. Wafer Bonding
   9.3. Silicon Epitaxial Growth
   9.4. Solid Phase Crystallization
10. Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects Market– By Product: 
   10.1. Memories
   10.2. Light emitting diodes
   10.3. Sensors
   10.4. Power and analog components
   10.5. Micro electro mechanical systems
   10.6. Others
11. Three-dimensional Integrated Circuit (3D IC Chip) and Through-Silicon Via (TSV) Interconnects Market– By Geography:
   11.1. Introduction
   11.2. Global Study
   11.3. Americas
      11.3.1. North America
      11.3.2. Brazil
      11.3.3. Argentina
      11.3.4. Others
   11.4. Europe
      11.4.1. U.K.
      11.4.2. France
      11.4.3. Germany
      11.4.4. Others
   11.5. APAC
      11.5.1. China
      11.5.2. Japan
      11.5.3. India
      11.5.4. Others
   11.6. ROW
12. Market Entropy
   12.1. New Product Launches
   12.2. M&As, Collaborations, JVs and Partnerships
13. Company Profiles
   13.1. Amkor technology
   13.2. Elpida memory Inc.
   13.3. IBM
   13.4. Intel corporation
   13.5. Micron technology Inc.
   13.6. Monolithic 3d Inc.
   13.7. NEC electronics corporation
   13.8. Qualcomm incorporated
   13.9.  Renesas electronics corporation
   13.10. Samsung electronics co ltd
   13.11. Sony
   13.12. Statschip pac
   13.13. St microelectronics
   13.14. Taiwan semiconductor manufacturing company limited
   13.15. Texas instruments incorporated  
*More than 40 Companies are profiled in this Research Report, Complete List available on Request*
"*Financials would be provided on a best efforts basis for private companies"
14. Appendix

   14.1. Abbreviations
   14.2. Sources
   14.3. Research Methodology
   14.4. Bibliography
   14.5. Compilation of Expert Insights
   14.6. Disclaimer
Please select Licence
Single User Licence:
US $4250
Corporate User Licence:
US $6250
Related Reports
0px;">Scroll