The design of a semiconductor device defines how well the device will perform in a particular application. With the increasing penetration of semiconductor devices in various industrial applications the semiconductor device manufacturers are trying to offer high reliability products through modification in design, development and manufacturing processes. The companies aim for “Zero Defect” products. The first step in increasing the reliability of a device is identifying the modes of failure of that device. Failure analysis helps to analyze and find the root cause of failure.
Failure analysis of a semiconductor is the process of investigating failed semiconductor devices by electric measurement, and also by physical and chemical analysis techniques; this is done to confirm the stated failure and explain the failure mode or mechanism. Failure analysis helps to modify the design of the component and make it more reliable.
Companies are spending a significant amount on installing failure analysis devices in their laboratories. This will result in streamlining the production process and manufacture defect free products. Recently, Nvidia Technologies showcased its $20 million chip analysis lab. This lab is capable of analyzing the transistor layer by layer and identifies the cause of failure.
The semiconductor devices may have failures both because of internal structure and also because of improper soldered connections. These solders connection are either between the chip and its packaging and the circuit board and the packaging. The failure analysis process thus helps identify the causes of failure and assist in redesigning the product. The modifications made in the device design makes it more reliable.
However, the market for failure analysis
is yet established because of the high cost associated with it. According to a recent report by an India based market research company IndustryARC the market for failure analysis is forecast to grow at a CAGR of 7.76% through 2016 to 2021.
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