Copper Wire Bonding ICs Market By Bond Type 2021 | IndustryARC
  • 1-614-588-8538 (Ext: 101)
  • US Toll Free

Copper Wire Bonding ICs Market
Copper Wire Bonding ICs Market: By Bond Type (Ball-Ball Bonds, Wedge-Wedge Bonds & Ball-Wedge Bonds), By Packaging Technology (SOP, GA, QFN, DFN, QFP, DIP & Others Packages), By End-User & By Region-Forecast (2016-2021)
Report Code : ESR 0245
Updated Date: 26 February, 2016  

Copies sold

    Client Rating

  • Report Description
  • Table of Contents
  • Customization Options
The ever increasing gold prices led to the transition of replacing gold with copper bond wires in semiconductor devices. Copper wire bonded ICs begin to be adopted in production consumer grade ICs in 2009 & 2010. Nowadays, copper wire bonded ICs have started being used in harsh environment applications, by replacing complex ICs, owing to process optimization. Globally, rising gold prices, growing global consumer electronics industry, and increasing adoption in automotive industry are the prime growth drivers of global copper wire bonding ICs market. In addition, growing consumer electronics and automotive industry in emerging economies such as China, India and others, will create new opportunities for global copper wire bonding ICs market. However, complex production process requiring improved designs and equipment, and lack of reliability for harsh environment applications and long life are the key restraints for global copper wire bonding ICs market.

This report identifies the global copper wire bonding ICs market size in for the year 2014-2016, and forecast of the same for year 2021. It also highlights the potential growth opportunities in the coming years, while also reviewing the market drivers, restraints, growth indicators, challenges, market dynamics, competitive landscape, and other key aspects with respect to global copper wire bonding ICs market.
Copper Wire Bonding ICs Market

Geographically North America dominated global copper wire bonding ICs market, and Asia Pacific is projected to have fastest growth, owing to rapidly increasing mobile user, consumer electronics and growing automotive industry in this region. Among all the end-users, consumer electronics segment has the highest market share in global copper wire bonding ICs market.

This report segments global copper wire bonding ICs market on the basis of bond type, packaging technology, end-user, and regional market as follows:
  • Copper Wire Bonding ICs Market, By Bond Type: Ball-Ball Bonds, Wedge-Wedge Bonds, and Ball-Wedge Bonds
  • Copper Wire Bonding ICs Market, By Packaging Technology: Small Outline Package (SOP), Grid Array (GA), Quad Flat No-Leads (QFN) Package, Dual Flat No-Leads (Dfn) Package, Quad Flat Package (QFP), Dual In-Line Package (DIP), and Others
  • The report has focused study on copper wire bonding ICs market by basis of end-user such as: Consumer Electronics, Automotive, Aviation, Defence, Infrastructure, and Others
  • This is report has been further segmented into major regions, which includes detailed analysis of each region such as: North America, Europe, Asia-Pacific (APAC), and Rest of the World (RoW) covering all the major country level markets in each of the region

This report identifies all the major companies operating in the copper wire bonding ICs market. Some of the major companies’ profiles in detail are as follows:
  • Freescale Semiconductor Inc.
  • Cirrus Logic Inc.
  • Fairchild Semiconductor International, Inc.
  • Integrated Silicon Solution Inc.
  • Infineon Technologies AG
1. Copper Wire Bonding ICs – Market Overview
2. Executive Summary
3. Copper Wire Bonding ICs Market Landscape

   3.1. Market Share Analysis
   3.2. Comparative Analysis
   3.3. Product Benchmarking
   3.4. End User Profiling
   3.5. Top 5 Financials Analysis
4. Copper Wire Bonding ICs – Market Forces
   4.1. Drivers
      4.1.1. Rising gold prices
      4.1.2. Growing global consumer electronics industry
      4.1.3. Increasing adoption in automotive industry
   4.2. Restraints
      4.2.1. Complex production process requiring improved designs and equipment
      4.2.2. Lack of reliability for harsh environment applications and long life
   4.3. Opportunities
      4.3.1. Emerging economies
   4.4. Challenges
   4.5. Porter’s Five Forces Analysis
      4.5.1. Bargaining Power of Suppliers
      4.5.2. Bargaining Power of Buyers
      4.5.3. Threat of New Entrants
      4.5.4. Threat of Substitutes
      4.5.5. Degree of Competition
5. Copper Wire Bonding ICs Market, By Bond Type
   5.1. Ball-Ball Bonds
   5.2. Wedge-Wedge Bonds
   5.3. Ball-Wedge Bonds
6. Copper Wire Bonding ICs Market, By Packaging Technology
   6.1. Small Outline Package (SOP)
   6.2. Grid Array (GA)
   6.3. Quad Flat No-Leads (QFN) Package
   6.4. Dual Flat No-Leads (Dfn) Package
   6.5. Quad Flat Package (QFP)
   6.6. Dual In-Line Package (DIP)
   6.7. Others
7. Copper Wire Bonding ICs Market, By End-User
   7.1. Consumer Electronics
   7.2. Automotive
   7.3. Aviation
   7.4. Defence
   7.5. Infrastructure
   7.6. Others
8. Global Copper Wire Bonding ICs Market, By Geography
   8.1. Europe
      8.1.1. Germany
      8.1.2. France
      8.1.3. Italy
      8.1.4. Spain
      8.1.5. Russia
      8.1.6. U.K.
      8.1.7. Rest of Europe
   8.2. Asia Pacific
      8.2.1. China
      8.2.2. India
      8.2.3. Japan
      8.2.4. South Korea
      8.2.5. Rest of Asia-Pacific
   8.3. North America
      8.3.1. U.S.
      8.3.2. Canada
      8.3.3. Mexico
   8.4. Rest of the World (RoW)
      8.4.1. Brazil
      8.4.2. Rest of RoW
9. Copper Wire Bonding ICs – Market Entropy
   9.1. Expansion
   9.2. Technological Developments
   9.3. Merger & Acquisitions, and Joint Ventures
   9.4. Supply- Contract
10. Company Profiles
   10.1. Freescale Semiconductor Inc.
      10.1.1. Introduction
      10.1.2. Financials
      10.1.3. Key Insights
      10.1.4. Key Strategy
      10.1.5. Product Portfolio
      10.1.6. SWOT Analysis
   10.2. Cirrus Logic Inc.
      10.2.1. Introduction
      10.2.2. Financials
      10.2.3. Key Insights
      10.2.4. Key Strategy
      10.2.5. Product Portfolio
      10.2.6. SWOT Analysis
   10.3. Fairchild Semiconductor International, Inc.
      10.3.1. Introduction
      10.3.2. Financials
      10.3.3. Key Insights
      10.3.4. Key Strategy
      10.3.5. Product Portfolio
      10.3.6. SWOT Analysis
   10.4. Integrated Silicon Solution Inc.
      10.4.1. Introduction
      10.4.2. Financials
      10.4.3. Key Insights
      10.4.4. Key Strategy
      10.4.5. Product Portfolio
      10.4.6. SWOT Analysis
   10.5. Infineon Technologies AG
      10.5.1. Introduction
      10.5.2. Financials
      10.5.3. Key Insights
      10.5.4. Key Strategy
      10.5.5. Product Portfolio
      10.5.6. SWOT Analysis
   10.6. Fujitsu Ltd.
      10.6.1. Introduction
      10.6.2. Financials
      10.6.3. Key Insights
      10.6.4. Key Strategy
      10.6.5. Product Portfolio
      10.6.6. SWOT Analysis
   10.7. KEMET Corporation
      10.7.1. Introduction
      10.7.2. Financials
      10.7.3. Key Insights
      10.7.4. Key Strategy
      10.7.5. Product Portfolio
      10.7.6. SWOT Analysis
   10.8. Lattice Semiconductor Corporation
      10.8.1. Introduction
      10.8.2. Financials
      10.8.3. Key Insights
      10.8.4. Key Strategy
      10.8.5. Product Portfolio
      10.8.6. SWOT Analysis
   10.9. Maxim Integrated
      10.9.1. Introduction
      10.9.2. Financials
      10.9.3. Key Insights
      10.9.4. Key Strategy
      10.9.5. Product Portfolio
      10.9.6. SWOT Analysis
   10.10. Micron Technology, Inc.
      10.10.1. Introduction
      10.10.2. Financials
      10.10.3. Key Insights
      10.10.4. Key Strategy
      10.10.5. Product Portfolio
      10.10.6. SWOT Analysis
*More than 40 Companies are profiled in this Research Report, Complete List available on Request*
"*Financials would be provided on a best efforts basis for private companies"
11. Appendix

   11.1. Abbreviations
   11.2. Sources
   11.3. Research Methodology
   11.4. Expert Insights
Please select Licence
Single User Licence:
US $4250
Corporate User Licence:
US $6250
Related Reports