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Increased rate of
technology change in the Printed Circuit
Board (PCB) market is due to the augmented growth in the electronics
industry.
Demand for the enhanced
electronic products had resulted in new technologies in PCB segment, such as
- Multilayer PCB
- High Density Interconnection (HDI)
- Flexible PCBs.
Proliferation of smart
phones and digital control in the various applications such as defense,
aerospace, automotive and medical industries fueled in the growth of PCB
market.
North America’s PCB market is considered as a diverse market. Manufacturers in North
America tend to come up with new technologies every time because of heavy
demand in the products that use Wireless data. Access to high speed wireless
data has become mandatory in various industries including, Mobile networks,
Defense applications and many more. Thus high frequency PCB has been evolved to
address increased functionality, higher power levels and reduced solution cost.
More Advanced PCBs sold in the North America are mostly used in high-end and low
volume applications.
Smartphones market is projected to reach
$407 billion in North America by the end of 2015 and it
is growing at a CAGR of 25%. Tablets
market is also increasing steadily, but is estimated to decrease by 8% and reach $62 billion by 2015. Every
market apart from smart phones is decreasing. Smart phones market is in huge demand due to the evolution of 4G LTE and slim, portable devices
handsets. Overall urge for the small size and flexible electronic products have
led in the expansion of PCB market by developing flexible PCBs and rigid-flex
PCBs.
It
is anticipated that long-term growth of PCB market in North America might stay
constant or decrease because the dominant customers of PCB market are changing
continuously. Growth of electronic manufacturing and original design
manufacturing (ODM) has been increasing in Asia Pacific because of low
manufacturing cost. China PCB market is
expected to grow because of the developing opportunities in the
telecommunication industry.
- 3D Inkjet
printing technology made fabrication of PCB’s easy as well as faster compared
to other traditional techniques.
In today’s dynamically changing and competitive world, the intensity of technological changes has become the hallmark of industrial, commercial and residential productivity evolution. Because of the evolution of powerful electronic products, growth for complex and high end PCBs is been increasing. By using traditional methods, it would be difficult to produce complex PCBs quickly with low cost. But, now it is possible with the help of inkjet printer. Third generation drop-on-demand inkjet printer helps in fabricating flexible PCBs with low cost maintenance. Industrial inkjet printers could print 60 panels per hour at 600 dpi resolution with on-the-fly UV curing and a power consumption of only 400 watts.
If the deposition of materials is processed by 3D inkjet technology then it replaces traditional solder mask, legend application and imaging processes in PCB fabrication. This process enhances the productivity by improving yield, accuracy, reliability and at the same time reduces the demand for manpower and eliminates the process of treating waste products. To print solder mask and legend application needs only three stages but the traditional methods require seven stages and cost saving would be reduced by almost 50% per panel when compared with the photo imaging process. By using 3D inkjet technology several technical benefits can be achieved including, zero clearance, different thickness in different parts can be printed, glossy, matte or semi-matte print can be obtained from the same ink.
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