Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market
deals in designing and manufacturing the integrated circuits. 3D IC is an integrated circuit manufactured by stacking silicon wafers and interconnecting them by using through-silicon vias.
TSV technology is being developed for many applications, like MEMS, mobile phone, CMOS image sensor, bioapplication devices, and memory products. Integrated 3D circuit is used in manufacturing the products like light emitting diodes, sensors, power and analog components, micro electro mechanical systems and others. Rising demand for electronic devices is driving the three-dimensional integrated circuit & through-silicon via interconnects market growth.
New opportunities are created for the manufacturers because they are allowed to devise consumer electronic devices by Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market. The current semiconductor suppliers are expected to expand onto 3D IC technology. The market is expected to have a healthy growth in the future. In terms of revenue the market is still in the early stage and can expect to see an increase in the adoption and revenue generation by the end of the forecast period.
Geographically, Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market is segmented into Asia-Pacific, North America, Europe and Rest of the World. Asia-Pacific is expected to have the highest growth till well beyond the forecast period. Also, it is leading the highest position followed by North America and Europe.
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