Flip Chip Market to Touch USD 48,329.4million by 2030; Rising Demand from Automotive Sector is Poised to Facilitate Market Growth

Flip Chip Market size is estimated to reach $48,329.4million by 2030, growing at a CAGR of 7.5% during the forecast period 2024-2030, according to a recent report published by IndustryARC, titled, “Flip Chip Market By Solder (Copper, Tin, Tin-Lead, Lead Free, High Lead, Gold, Electrically Conductive Epoxy Adhesives, Eutectic, Others), By Substrate (Laminates, Ceramics, Polyamides, Glass, Silicon, Others), By Bonding (Adhesion Mechanism, Metallurgical bonding, Direct Bonding, Hydrogen Bonding, Mechanical Interlocking, Vitreous Bonding), By Solder Technique (Solder Bumping, Stud Bumping, Adhesive Bumping), By Packaging (Flip Chip Ball Grid Array (FC BGA), Flip Chip-Pin Grid Array (FC PGA), Flip chip Land Grid Array (FC LGA), Flip Chip System In A Package (FC SiP), Flip Chip Scale Package (FC CSP), Wafer Level Chip Scale Package (WLCSP), Flip Chip Quad Flat No Lead (FCQFN)), By Application (Memory Based, RF, Analog, Mixed Signal and Power IC(2D IC, 2.5D IC, 3D IC), Sensors (IR Sensors, CMOS Image Sensors, Others), Light emitting diode, Central Processing Unit, Graphics Processing Unit, System-on-a-chip, Optical Devices, Micro electrical mechanical systems (MEMS) devices, Surface acoustic wave (SAW) devices, Others), By End User (Consumer Electronics, Automotive, Industrial Equipment, Healthcare, Military & Defense, Aerospace, IT & Telecom, Others), By Geography - Global Opportunity Analysis & Industry Forecast, 2024-2030.

Asia-Pacific holds the largest Flip Chip Market share with 72% of the overall market in 2023.The Asia Pacific region is home to several major chip manufacturers, including Samsung, TSMC, and Intel. These companies are investing heavily in the development of flip chip technology to meet the growing demand for high-performance and energy-efficient electronic devices. China is emerging as a key player in the flip chip market, with several domestic manufacturers entering the market to meet the increasing demand for flip chip technology. The country is also investing heavily in the development of advanced semiconductor technologies, which is expected to boost the growth of the flip chip market in the region.

Wearable gadgets such as smartwatches, fitness trackers, and smart eyewear demand compact, lightweight, and power-efficient components, which flip chip technology may provide. Flip chip packaging also allows for the integration of numerous components into a single package, lowering total device size and weight. The growing popularity of wearable technology can be attributed to several factors, including advancements in technology, increasing awareness about health and fitness, and the desire for convenience and accessibility. Wearable devices allow users to track their health and fitness goals, monitor their heart rate, sleep patterns, and activity levels and receive notifications and alerts from their smartphones.

As the world embraces 5G networks, the demand for advanced packaging technologies is growing, with flip chips being a favored option. Flip chips are a popular packaging technology that involves the direct attachment of semiconductor chips to substrates, such as printed circuit boards, using solder bumps. In addition to their benefits for 5G applications, flip chips are also favored for other high-performance applications, such as graphics processing units, artificial intelligence, and data centres. The growing adoption of these technologies is further fuelling the demand for flip chips.

• In 2019, Taiwan Semiconductor Manufacturing Company (TSMC) acquired FlipChip International, a leading provider of flip chip packaging solutions.

• In 2019, Amkor Technology acquired the former Toshiba Electronics factory in Malaysia, which specializes in flip chip packaging.

Key companies profiled in the Flip Chip Market are Texas Instruments, STMicroelectronics,Intel Corporation, Samsung Group, Amkor Technology, TDK Electronics Group, IBM Corporation, Taiwan Semiconductor Manufacturing Company, 3M Company and Kyocera International.