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Market Overview:
The Fan-Out Packaging Materials and Equipment Market size is estimated to reach $5.2 billion by 2030, growing at a CAGR of 15.2% during the forecast period 2024-2030, according to a recent report published by IndustryARC, titled, “Fan-Out Packaging Materials and Equipment Market Size, Share & Trends Analysis Report- By Type (Core Fan-out, High-density fan-out, & Ultra high-density fan-out), By Process Type (Carrier bonding & debonding, pick & place, RDL Passivation, & Others), By Business Model (OSAT, Foundry, IDM), By Application (PMICs, RF Transceivers, Connectivity Modules, Audio/Codec Modules, Radar modules & sensors, Others), By Geography – Opportunity Analysis & Industry Forecast, 2024-2030”
The introduction of ECP (Encapsulated Chip Package) and rising automotive and industrial applications are fueling the growth of the Fan-Out Packaging Materials and Equipment industry during the forecast period.
Asia-Pacific Dominated the Market in 2023:
Asia-Pacific is projected to be the largest market for Fan Out Packaging Materials and Equipment, driven by key economies such as Taiwan, China, India, and Japan. The region is expected to dominate the market, with a significant share attributed to India's rapidly growing electronics sector, which is anticipated to reach $400 billion by 2025. Major companies like Amkor Technology and Taiwan Semiconductor Manufacturing Company (TSMC) are expanding their operations in this region. TSMC's planned $100 billion investment in manufacturing facilities across Taiwan, Japan, and the U.S. underscores the strategic importance of Asia-Pacific in the global semiconductor landscape.
Fan-Out Packaging Materials and Equipment Market: Key Takeaways
Introduction of ECP (Encapsulated Chip Package) is Driving the Market Growth:
The introduction of Encapsulated Chip Package (ECP) technology is poised to significantly influence the market for Fan Out Packaging Materials and Equipment. As electronics miniaturization advances, integrated circuits have become essential in our daily lives, particularly with the rise of the Internet and multimedia. The progress in integrated circuits relies heavily on improvements in chip design, manufacturing, and packaging to ensure reliability. ECP technology, which utilizes a chip-first and face-down approach, employs laminating molding films instead of traditional molding compounds. This method enhances wafer flatness and reduces warpage, enabling effective fan-out packaging solutions with high performance and minimal size.
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Market Growth Driven by Rising Automotive and Industrial Applications:
The surge in automotive and industrial applications is propelling the growth of the Fan Out Packaging Materials and Equipment market. The automotive sector has seen significant expansion due to rising demands for automation and enhanced vehicle performance. This shift necessitates advanced semiconductor packaging solutions tailored for next-generation automotive requirements. Traditionally reliant on wire bond packages, the industry is now transitioning to high-performance flip chip and advanced fan-out packages for applications like infotainment and radar systems. Noteworthy developments include ASE Group's FO-WLP line in Taiwan and Powertech Technology Inc.'s pioneering fan-out panel-level packaging technology, which highlights the industry's response to growing technological demands.
Scope of the Report:
Recent Developments:
• In July 2022, South Korea's LB Semicon announced plans to offer fan-out wafer-level packaging solutions starting in 2023. This strategic move aims to decrease the company's reliance on its display driver IC dumping business. Additionally, LB Semicon provides testing services for CMOS image sensors and application processors, enhancing its capabilities in advanced semiconductor packaging technologies.
Fan-Out Packaging Materials and Equipment Market: Competitive Landscape
Key companies profiled in the Fan-Out Packaging Materials and Equipment Market are Taiwan Semiconductor Manufacturing Company Limited, ASE Group, JCET Group, Amkor Technology, Powertech Technology Inc., Nepes Laweh, Samsung Electronics, Evatec AG, Camtek, Atotech, and others.
About IndustryARC™:
IndustryARC primarily focuses on Market Research and Consulting Services specific to Cutting Edge Technologies and Newer Application segments of the market. The company’s Custom Research Services are designed to provide insights into the constant flux in the global demand-supply gap of markets.
IndustryARC’s goal is to provide the right information required by the stakeholder at the right point in time, in a format that assists an intelligent and informed decision-making process.
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IndustryARC
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