Mobile SoC Market Research Report: Market size, Industry outlook, Market Forecast, Demand Analysis,Market Share, Market Report 2018-2023
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Mobile SoC Market
Mobile SoC Market: By Technology (20nm Chips, 14nm Chips, 10nm Chips and Others); By Component (Microprocessor, Memory, Display and Industrial); By Utilization (Dual Core, Quad Core and Octa Core) & By Geography - Forecast (2017-2023)
Report Code : ESR 0514
Updated Date: 03 June, 2018  
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  • Report Description
  • Table of Contents
  • Tables And Figures
  • Customization Options
1. Mobile SoC Market - Overview
2. Mobile SoC Market - Executive Summary 
3. Mobile SoC - Market Landscape
   3.1. Market Share Analysis
   3.2. Comparative Analysis
      3.2.1. Product Benchmarking
      3.2.2. End User Profiling
      3.2.3. Top 5 Financials Analysis
      3.2.4. Patent Analysis
4. Mobile SoC Market - Forces
   4.1. Drivers
   4.2. Constraints & Challenges
   4.3. Porter's Five Forces Analysis
      4.3.1. Bargaining Power of Suppliers
      4.3.2. Bargaining Power of Buyers
      4.3.3. Threat of New Entrants
      4.3.4. Threat of Substitutes
      4.3.5. Degree of Competition
5. Mobile SoC Market - Strategic Analysis
   5.1. Value Chain Analysis
   5.2. Pricing Analysis
   5.3. Opportunities Analysis
   5.4. Product/Market Life cycle Analysis
6. Mobile SoC Market - By Technology
   6.1. Introduction
   6.2. 20nm Chips
   6.3. 14nm Chips
   6.4. 10nm Chips 
   6.5. Others
7. Mobile SoC Market - By Component
   7.1. Introduction
   7.2. Microprocessor/MCU
   7.3. Memory
   7.4. Display 
   7.5. Sensors
   7.6. Audio and Video Decoders
   7.7. Timers
   7.8. Others
8. Mobile SoC Market - By Utilization
   8.1. Introduction
   8.2. Dual Core
   8.3. Quad Core
   8.4. Octa Core
9. Mobile SoC Market - By Geography
   9.1. Introduction
   9.2. North America
      9.2.1. U.S.
      9.2.2. Canada
      9.2.3. Mexico
   9.3. Europe
      9.3.1. U.K.
      9.3.2. Germany 
      9.3.3. France
      9.3.4. Italy
      9.3.5. Rest of Europe
   9.4. Asia-Pacific
      9.4.1. China
      9.4.2. Japan
      9.4.3. India
      9.4.4. Australia & New Zealand
      9.4.5. Rest of Asia-Pacific
   9.5. Row
      9.5.1. South America
      9.5.2. Middle East
      9.5.3. Africa
10. Mobile SoC - Market Entropy
   10.1. Expansion
   10.2. Technological Developments
   10.3. Merger & Acquisitions, and Joint Ventures
   10.4. Supply- Contract
11. Company Profiles (Overview, Financials, SWOT Analysis, Developments, Product Portfolio)
   11.1. Company 1
   11.2. Company 2
   11.3. Company 3
   11.4. Company 4
   11.5. Company 5
   11.6. Company 6
   11.7. Company 7
   11.8. Company 8
   11.9. Company 9
   11.10. Company 10
*More than 10 Companies are profiled in this Research Report*
"*Financials would be provided on a best efforts basis for private companies"
12. Appendix
   12.1. Abbreviations
   12.2. Sources
   12.3. Research Methodology
   12.4. Bibliography
   12.5. Compilation of Expert Insights
   12.6. Disclaimer
Mobile phones are becoming important part of our daily life. With technological advancement and significant changes in the processor architecture have resulted in transforming the typical mobile phones to modern smart phones. Enhanced mobile processor design over past years is largely affected by performance, and low-power operation. In SoC based designs for mobile phones, system tasks are managed by integrating microcontrollers, dedicated ASIC's, or DSP's in one single chip. Multicore SoC technology has been emerged to deliver high performance and low power designs. Smartphones are basically smaller computers that consist of almost same components as in desktops and laptops to offer excellent features such as music and video playing, 3D gaming, advanced wireless features and many more.

Mobile SoC market is comprehended by technology, component and utilization. By technology the market is further segmented into 20nm chips, 14nm chips, 10nm chips and others. Based on component the market is categorized into microprocessor/MCU, memory, display, sensors, audio and video decoders, timers and others. By utilization the market is further segmented into dual core, quad core and octa core.

Mobile SoC Market

Mobile SoC market is further analyzed on the basis of regions such as: North America, Europe, Asia-Pacific and Rest of the World.

Sample Companies profiled in this report are:
  • Qualcomm Technologies, Inc. (U.S.),
  • Apple Inc. (U.S.),
  • Samsung Group (South Korea),
  • MediaTek Inc. (Taiwan),
  • Spreadtrum Communications, Inc. (China),
  • 10+.

Increase in adoption of the IoT (Internet of Things) technology across different sectors and the vast advancements in the field of networking services have helped in broadening the scope and use of SoC in mobiles. Rise in growth of mobile phones and tablets has led to changes throughout the semiconductor and automated test equipment industry.

The research methodology opted for this report incorporates initial segregation of the market by technology, component, utilization and geography. This was followed by mining of market volume and revenue of different technologies of mobile soc employed by various utilization with respect to regions considered. Bottom up approach was then followed for estimating the global market size and its forecast for period 2017 to 2023. The data figures and supporting insights so collated were validated through primary research process by Key Opinion Leaders (KOLs) which comprised of manufacturers, distributors, suppliers, associations and end users.
LIST OF TABLES

Table 1: MOBILE SOC HARDWARE/ FIRMWARE ENGINEERING – BY TYPE
Table 2: FOLLOWING ARE THE LIST MOBILE SOCS THAT ARE USED BY DIFFERENT SMARTPHONE MANUFACTURERS
Table 3: ANALYSIS OF MSOC USED IN PHONES AVAILABLE IN THE MARKET
Table 4: ANALYSIS OF MSOC USED IN UPCOMING PHONES
Table 5: TSMC - DESIGN FOR MANUFACTURING (DFM) OFFERINGS
Table 6: COMPARISON OF DIFFERENT IP FORMATS
Table 7: EXAMPLES OF IP
Table 8: IP SELECTION
Table 9: APPROACHES TO 3RD PARTY IP USE
Table 10: BEST PRACTICES FOR IP SELECTION ACCORDING TO MEDIATEK
Table 11: BEST PRACTICES FOR SOFT IP:
Table 12: BEST PRACTICES FOR STRUCTURED-ASIC DESIGN FOLLOWED BY QUALCOMM:
Table 13: THE FIRM IP BEST PRACTICES:
Table 14: COMPARISON OF APPROACHES FOR OPTIMIZING HYBRID SOC SYSTEMS
Table 15: TYPES OF PROTOTYPING THAT HELP DEVELOPERS TO REDUCE IMPACT OF DEPENDENCIES
Table 16: MAJOR FACTORS IN SYSTEM DOMAIN INTEGRATION
Table 17: SYSTEM DOMAIN DEBUG BEST PRACTICES
Table 18: RTL DESIGN BEST PRACTICES
Table 19: STRUCTURAL DESIGN BEST PRACTICES
Table 20: PHYSICAL DESIGN TESTING
Table 21: THE FIVE PHASE DESIGN FLOW COMPRISE OF
Table 22: HARDWARE INTEGRATION/ FOUNDRY BEST PRACTICES FOR APPLE
Table 23: VERIFICATION BEST PRACTICES FOLLOWED BY SAMSUNG (OLD)
Table 24: VERIFICATION BEST PRACTICES FOLLOWED BY QUALCOMM
Table 25: SOC TEST BEST PRACTICES FOLLOWED BY SAMSUNG
Table 26: SNAPDRAGON 800 SERIES, BY SPECIFICATIONS
Table 27: SNAPDRAGON 600 SERIES, BY SPECIFICATIONS
Table 28: SAMSUNG MODEL, BY SPECIFICATIONS
Table 29: APPLE MODEL, BY SPECIFICATIONS
Table 30: TYPICAL DYNAMIC INSTRUCTION USAGE
Table 31: HIGHLIGHT OF THE LAST DECADE OF ARM DEVELOPMENT
Table 32: STEPS FOR OPTIMIZING FLOOR PLANS
Table 33: AREA COMPARISON FOR DIFFERENT MEMORY TECHNOLOGY
Table 34: MEMORY SPEED COMPARISON FOR MAJOR SOCS
Table 35: I/O SPECIFICATIONS FOR INTEL 82801 FR I/O CONTROLLERS
Table 36: COMMON I/O DESIGN STRATEGIES FOR HIGH-SPEED INTERFACE
Table 37: THE TABLE BELOW SHOWS THE POTENTIAL FOR POWER SAVING IN CONTEXT TO THE DESIGN FLOW OF SOC
Table 38: IMPACT OF THE VARIOUS TECHNIQUES ON POWER TYPES TARGETED AND VERIFICATION
Table 39: IMPACT OF THE VARIOUS TECHNIQUES ON POWER TYPES TARGETED AND VERIFICATION
Table 40: MAJOR SENSORS USED IN MAJOR SOCS
Table 41: DISPLAY USED IN MAJOR SOCS
Table 42: MAJOR AUDIO VIDEO CODECS USED IN MAJOR SOCS
Table 43: BEST PRACTICES OF BSP DEVELOPMENT FOLLOWED BY TEXAS INSTRUMENTS
Table 44: FEATURES OF QUALCOMM’S BSP
Table 45: MAJOR COMPONENTS USED IN SOCS
Table 46: FOLLOWING ARE SOME TOOLS WITH DESCRIPTION OFFERED BY SYNOPSYS
Table 47: LIST OF PRIMARY FEATURES IN QUALCOMM 820
Table 48: LIST OF PRIMARY FEATURES IN QUALCOMM 810
Table 49: LIST OF PRIMARY FEATURES IN APPLE A9
Table 50: COMPARISON OF APPLE A9 AND APPLE A8 SOCS
Table 51: APPLE SOC EVOLUTION (COMPARING LAST FEW PRODUCTS)
Table 52: LIST OF PRIMARY FEATURES IN SAMSUNG EXYNOS 8890
Table 53: LIST OF PRIMARY FEATURES IN SAMSUNG EXYNOS 7420
Table 54: BLOCK & DIE SIZES (MM²)
Table 55: FOLLOWING ARE THE ABBREVIATIONS USED IN THE MOBILE SOC REPORT
Table 56: LIST OF UNIVERSITY DOCUMENTS
Table 57: LIST OF BOOKS
Table 58: KEY POINTERS FROM THE INDUSTRY EXPERTS


LIST OF FIGURES

Figure 1: MOBILE SOC – SIMPLIFIED VALUE CHAIN
Figure 2: PROCESSOR PLANNING TO PRODUCTION PHASE
Figure 3: MOBILE SOC PRODUCT LIFECYCLE MANAGEMENT – BY APPLICATIONS AND PROCESSES
Figure 4: MOBILE SOC DEVELOPMENT TOOLS
Figure 5: DESIGN AND MANUFACTURING FLOW FOR SOC
Figure 6: GROWTH OF MULTI-PATTERNING TECHNIQUES BY TECHNOLOGY NODE
Figure 7: TIME SPENT IN DESIGN PHASE
Figure 8: TOP-DOWN DESIGN FLOW AND BOTTOM-UP DESIGN FLOW
Figure 9: TRADITIONAL WATERFALL DESIGN FLOW
Figure 10: SPIRAL SOC DESIGN FLOW
Figure 11: FOUNDRY PHASE PROCEDURE
Figure 12: TSMC QUALITY MANAGEMENT SYSTEM
Figure 13: SAMSUNG’S ORGANIZATIONAL STRUCTURE FOR COMPLIANCE MANAGEMENT
Figure 14: PROCESSING ENGINES IN A SNAPDRAGON SOC
Figure 15: STRATEGY FOLLOWED BY THE KEY PLAYERS IN SOC (%)
Figure 16: IP QUALIFICATION PROCESS
Figure 17: RELATIVE COST OF FIXING IP WITH DESIGN CYCLE
Figure 18: VERIFICATION PROCESS
Figure 19: DISTRIBUTED TOOLS INVOCATION WITH TRMS
Figure 20: COST MANAGEMENT BASICALLY HAS FOUR PROMINENT STEPS
Figure 21: COST ANALYSIS OF SOC DESIGN FOR 16/14NM
Figure 22: BREAKEVEN COST SHIPMENTS FOR $20 SOC, BY NODE PROCESS, MILLION UNITS
Figure 23: SUMMARY OF TEST REQUIREMENTS
Figure 24: VERIFICATION FLOW
Figure 25: PROCESS TECHNIQUES (VERIFICATION OF DESIGN DEVELOPMENTS)
Figure 26: FACILITY MANAGEMENT – ITS APPLICATIONS
Figure 27: COMPARISON OF FEATURES IN DIFFERENT TECHNOLOGIES
Figure 28: MEMORY USAGE IN SOCS
Figure 29: POWER OPTIMIZATION POTENTIAL AT DIVERSE LEVEL OF DESIGN ABSTRACTION
Figure 30: THE FIGURE BELOW SHOWS THE POWER OPTIMIZATION TECHNIQUES WITH RESPECT TO STATIC AND DYNAMIC POWER
Figure 31: TYPES OF SENSORS OPTED IN DIFFERENT SMARTPHONES
Figure 32: ARCHITECTURE OF GPIO
Figure 33: TYPICAL EDA FLOW
Figure 34: COST ANALYSIS OF SOC WITH IMPLEMENTATION OF NEW TECHNOLOGIES
Figure 35: LINKS BETWEEN THE MAIN DEVELOPMENT PHASES AND THE USE OF TLM VIRTUAL PLATFORM
Figure 36: COST ANALYSIS OF DEBUG IN THE DESIGN PROCESS
Figure 37: COMPARISON OF APPLE SOCS CPU FREQUENCY
Figure 38: TOTAL A9 CHIP MANUFACTURER DISTRIBUTION
Figure 39: FOLLOWING TOP 10 PERFORMANCE CHIPS FOR Q1 2015
Figure 40: GPU PERFORMANCE COMPARISON, ANTUTU BENCHMARK, Q1, 2015
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