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Overview
The Die Attach Film market size is forecast to reach USD 268.4 million
by 2029, after growing at a CAGR of 5.4% during the forecast period 2024-2029. Die Attach Film
(DAF) is an ultra-thin adhesive film
used to connect semiconductor chips to circuit boards or chips in semiconductor
packaging. It is also referred to as a dicing die-attach film. The primary
function of a die-attach film is to bond semiconductor chips (referred to as
dies), to the lead frame or package substrate. Its great dependability and ease
of processing allow for the lamination and manufacture of thin layers of
semiconductors. The market for die attach films has been driven by the emergence
of electric cars, 5G technologies, IoT devices, and renewable energy systems,
and also the trend toward smaller, lighter, and more powerful electronic
devices is driving the demand for advanced packaging solutions, including die
attach films.
Report Coverage
The report “Die Attach Film Market–
Forecast (2024-2029)”, by IndustryARC, covers an in-depth analysis of the
following segments of Die Attach Film.
By Resin Type: Epoxies, Maleimides, Bismaleimides,
Acrylates, Silicone, Cyanate esters
By Application: Die to Substrate, Die to Die, Film on Wire,
Board on chip, Packaging, Others
By End Use Industry: Industrial Applications, Automotive, Telecommunications,
Electronics, Others
By Geography: North America, South America, Europe, APAC, RoW
Key Takeaways
· The global die attach film market
indicates a trend towards thinner more precise film materials. Manufacturers
are concentrating on improving the efficiency of die attachment methods by
generating ultra-thin films that can assure optimal performance in semiconductor
devices.
· Die-Attach film (DAF) adhesive has
become popular and required when stack chips are utilized to achieve more
capacity in the 3-D packaging of flash memory devices. The current trend is towards increasingly
thinner insulating die-attach adhesives that can control interfacial stresses
in stacking chips with bond lines as thin as 8-10 microns or less, allowing
mobile devices to have even smaller profiles.
· In recent years, there has been a
significant increase in the need for smaller dies, such as Micro-Electro-Mechanical
Systems (MEMS), and sensors. Technologies such as automatic driving are gaining
traction, while market demands to reduce package size and improve mobile device
performance are rising. Die Attach Film
is increasingly being used in these applications to secure dies to substrates
and other dies.
By Type - Segment Analysis
Conductive Die attach Film led the market with a leading market
share in 2023. An electrically conductive material called Conductive Die Attach
film (or CDAF) is used for connecting integrated circuits (ICs) to printed
circuit boards (PCBs). Since CDAF has great thermal properties and low contact
resistance, it can offer enhanced performance over the traditional soldering of
ICs onto PCBs. It is also more affordable. Growing demand from the automotive
industry and the need for electrical device miniaturization are driving the
market.
These strategies support major players in the dynamic conductive die
attach film market in gaining significant market share and maintaining their
competitiveness. For instance, On May 3, 2023, Henkel announced that Loctite
Ablestik ABP 8068TI has joined its expanding line of high heat die attach
adhesives. The firm's new pressure-less sintering die attach paste has the
greatest thermal capability in its semiconductor packaging line, with a thermal
conductivity of 165 W/m-K. This meets the performance criteria for
high-reliability discrete power semiconductor devices in automotive and
industrial applications.
By Resin Type- Segment
Analysis
In general, epoxy die
attach is less complicated and more affordable than eutectic die attach. Unlike
eutectic die attach, it does not require exact control over the alloy
composition and reflow conditions. Furthermore, compared to the gold and other
precious metals frequently utilized in eutectic alloys, the materials used in
epoxy die attach are typically less expensive.
3D packaging trends are
expected to propel the epoxy resin die-attach film. For instance, in August 2022, Intel
highlighted the latest architectural and packaging innovations enabling the
2.5D and 3D tile-based chip designs that will bring about a new era in
chipmaking. Combined with other advances like High NA lithography, and
developments with 2.5D and 3D packaging, intel has an aspiration to move from
100 billion transistors on a package in 2022 to 1 trillion by 2030.
By End Use Industry – Segment Analysis
In 2023, electronics held
the majority of the die attach film market. Consumer electronics, industrial
electronics, and many types of electronic components are all included in the
broad and varied category of electronics. High-performance die attach films are
always in demand because of the widespread use of electronics in daily life and
the ongoing improvements in technology.
Die attach films are
essential in semiconductor packaging, where they are used to bond semiconductor
chips (or dies) to substrates, such as lead frames or printed circuit boards
(PCBs). This process is fundamental in the assembly of integrated circuits (ICs)
used in electronic devices like smartphones, computers, automotive electronics,
and many other consumer and industrial products.
The Semiconductor Industry
Association (SIA), stated that In the third quarter of 2023, sales of
semiconductors globally came to $134.7 billion, up 6.3% from the previous
quarter of 2023. As the sales of semiconductors rise, there is a corresponding
increase in the demand for semiconductor packaging materials, including die
attach films. Semiconductor packages are essential components of electronic
devices, and die attach films play a crucial role in bonding semiconductor
chips to substrates within these packages.
By Geography - Segment
Analysis
Asia Pacific dominated the die-attach film market owing to the increasing
electronic manufacturing in countries such as China, India, and Japan. In China
and Taiwan, a variety of devices, including optoelectronics, MEMS, and MOEMS,
are employed in the mass production of electronic goods, such as wearables,
smartphones, and white goods. Die-attach apparatus is needed for all of these
devices to assemble these components. Due to the increased need for the die-attach
film to boost the manufacture of these components, the die-attach film market
is growing in this region.
The growth can also be attributed to the growing investments made by
multinational corporations like LG Chem Inc., and Samsung Electronics Co.,
Ltd., who are making significant investments throughout the Asia Pacific region
to expand their production.
For example, Samsung Electronics said in March 2023 that it plans to
invest 300 trillion won over the next 20 years as part of an ambitious South
Korean national effort to establish the world's largest semiconductor
manufacturing base near Seoul. Taiwan Semiconductor Manufacturing Co. opened
its first factory in Japan in February 2024, opening the door for it to begin
producing smartphone and automotive chips for key local customers Sony and
Renesas.
Drivers – Die Attach Film Market
· Miniaturization Of Electronic Components Drives The Market:
Miniaturization of electronic components fosters die attach film
market. Miniaturized packages with increased die-to-pad ratio are increasing. For
example, in November 2022, Henkel announced the launch of a high-performance
non-conductive die attach film to fulfill the demands of current packaging
device designs. A notable development for ncDAF materials is Loctite Ablestik
ATB 125GR, which enables package integrators to source a single material that
can satisfy the needs of numerous demanding semiconductor applications within a
variety of end devices. With low ionics to aid in Cu wire bonding, the material
has shown strong adhesion on Ag, Cu, and PPF metal lead frames as well as
laminate substrates. It also offers excellent processability and workability for
all processing steps (lamination, dicing, and die pick-up) on dies with sizes
ranging from 0.5 mm x 0.5 mm to 3.0 mm x 3.0 mm.
Applications such as wireless devices, smart consumer gadgets, data
center infrastructure, and edge computing all require better input/output and
functional density, which is driving the miniaturization of all components. As
3D packaging downsizing accelerates in the microelectronics sector, smaller,
thinner, and higher-density package structures become the standard. For these
reasons, many packaging professionals prefer to die attach film materials over
pastes to enable more complex dimensions. Compared to pastes, die-attach films
offer regulated thickness and flow, no resin bleed, uniform fillet generation,
and bond line stability before and after curing.
· Rising Innovation In The Automotive Industry:
The Rising innovation in the automotive industry fuels die attached
film market. The automotive market is a major growth area for microelectronics.
Factors influencing this acceleration are autonomous driving, ADAS,
electrification (eMobility), better safety features, and robust infotainment
devices. All of these developing automotive gadgets, systems, sensors,
controllers, and processors rely on semiconductor technology to provide
improved functionality. Furthermore, because they work in a safety-critical setting,
reliability is one of the top production and performance concerns. High thermal
and/or electrical performance is required, which is commonly found in
microcontroller units (MCUs) and powertrain applications. This procedure is
made simpler by the die attach film, which permits die-to-die and
die-to-substrate connections, hence boosting market expansion throughout the
projected period.
Furthermore, the emerging trends of electric vehicles and autonomous
vehicles are also expected to fuel the demand for die attach film market. For
instance, According to IEA, global spending on electric cars exceeded $425
billion in 2022, up 50% relative to 2021. According to a study released by
Zebra Technologies Corporation, preferences will change, with over half of
consumers—up to 60% in APAC and 53% globally—indicating that they will choose
hybrid electric vehicles. These vehicles require advanced semiconductor
packaging solutions to enhance their performance, reliability, and durability.
To meet these requirements, die attach film is essential, and its potential
applications will eventually raise its market worth.
Challenges – Die Attach Film Market
·
Achieving The Stringent Reliability
Requirements:
Compliance with environmental regulations, such as restrictions on
hazardous substances (e.g., RoHS directives), presents challenges for die-attach
film manufacturers in developing environmentally friendly formulations. Compliance
with industry standards and specifications, such as JEDEC standards for
semiconductor reliability, adds a layer of complexity to the development and
qualification of die attach films. Manufacturers must ensure that their
products meet or exceed these standards to gain acceptance in the market.
Furthermore, die attach films and related technical information may be subject
to export control laws and regulations. Therefore it is difficult to engineer
die attach materials that can meet these strict dependability standards. Die
attach film suppliers need to meet cost and manufacturing targets. This
requires a great deal of chemistry balancing expertise. These provide challenges
to the die attach film market's commercial development.
Market Landscape
In 2023, the Major players in the die attach film market are Henkel
Adhesives, LG, Lintech Corporation, Hitachi Chemical, Furukuwa, Nitto Denko
Corporation, AI Technology Inc., NAMICS Corporation, Creative Materials Inc,
Dow Inc, and Others.
Developments:
Ø On April 04, 2023, Resonac Corporation will expand its capacity to
produce Dicing Die Bonding Film, a two-in-one adhesive film that serves as both
dicing tape and die bonding film in the semiconductor packaging process
(backend process), at its Goi Plant in Japan. The demand for Dicing Die Bonding Film, which
is primarily utilized in the semiconductor memory manufacturing process,
is predicted to rise gradually over the medium to long term. To cater to the increased demand for the
product, Resonac has chosen to enhance its capacity for manufacturing Dicing
Die Bonding Film by 60% above the present level. Resonac will begin operating enlarged
manufacturing facilities in 2026.
Ø On Nov 30, 2022, Henkel announced the commercialization of a
high-performance non-conductive die attach film (ncDAF) designed to meet the
needs of modern packaging devices.